Product

Products

LVP100H12E4-3TB

  • Compact Package

  • Low Switching Loss 

  • Assembled in PCB 

  • Integrated NTC temperature sensor

  • Isolated Baseplate by Al2O3 substrate 


Application

  • Three-Level Applications

  • Motor Drives

  • Solar Applications

  • UPS Systems

Internal Circuit Diagram

Specification Parameters

TYPET1, T4T2, T3CircuitPackageTechnology
VCES
Volts
IC
Amps
VCE(SAT)
Volts
Ptot
Watts
VCES
Volts
IC
Amps
VCE(SAT)
Volts
Ptot
Watts
LVP100H12E4-3TB1200V100A1.60V375W650V50A1.50V175WT typeEZPACK 2BTrenchFS
LVP150H07E4-3IB650V150A1.50V335W650V150A1.50V335WI typeTrenchFS
LVP150H12E4-3TB1200V150A1.50V500W650V75A1.50V215WT typeTrenchFS
LVP200H12E4-3TB1200V200A1.50V600W650V100A1.50V250WT typeTrenchFS


Industry Applications

BYSM Continues to Deepen its Efforts in the Field of High-end Precision Components
Building a National Brand and Linking the World with Intelligent Technology

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